Description:

* quality heating material form high temperature breeze; desoldering and soldering procedures of BGA are precisely controlled;

* Removable heating header, easy to operate;

* Touch screen interface, PLC control; real-time temperature curve display, able to display two detecting curves at the same time;

* 6 segments of temperature up (down) and 6 segments constant temperature control, 50 groups of temperature curve are stored, Curve analysis can be carried out on the touch screen.

* Able to arrive at three independent temperature zone, temperature and time can be displayed digitally on the touch screen.

* Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independent controlled;

* The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage

* Powerful cross flow fans cool the lower heating area rapidly;

* PCB rack is adjustable for protecting your hands from hot;

* Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for removing BGA;

* Over-heating alarm and protection for the upper hot gas heating header.

* With different Ti alloy hot gas nozzles, easy to replace.

Details: