Description:

* Made of quality heating material; desoldering and soldering procedures of BGA are precisely controlled;

* Air flow and temperature are adjustable in a wide range to form high temperature breeze;

* Removable heating header, easy to operate;

* Three independent heating areas , temperature and time are digital displayed;

* Infrared bottom heating board is independent controlled;

* Heaters can be movable in any location within the working area to fit for reworking BGA in different positions on PCB;

* Powerful cross flow fans cool the lower heating area rapidly;

* With different Ti alloy hot air nozzles, easy to replace;

* PCB rack is adjustable; X and Y axes are micro-adjustable; the supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area;

* Temperature of hot air is program controllable, with 8 segments of temperature up (down) and 8segments constant temperature control, 10 groups of temperature curve are stored, with computer communication function;

* Buzz after soldering is finished or removed;

* Movable vacuum pen is adjustable for heavy CGA;

* Precision flexible suction nozzle can safely desolder CGA;

* The precision mounting header can be 360 degree rotated in Φ angle, with precision and micro-adjustable mounting suction nozzle;

* Vacuum pen is easy to clean up PCB pads.

Details: