Description:

* Made of quality heating material; desolding and soldering procedures of BGA are precisely controlled;

* Air flow and temperature are adjustable in a wide range to form high temperature breeze;

* Removable heating header, easy to operate;

* Two independent heating areas, temperature and time are digital displayed;

* Large IR bottom heater will heat the PCB evenly to avoid deformation and keep the solder effect;

* Powerful cross flow fans cool the lower heating area rapidly;

* With different Ti alloy hot air nozzles, easy to replace;

* PCB rack is adjustable for protecting your hands from hot;

* The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area;

* 8 segments of temperature up (down) and 8 segments constant temperature control, 10 groups of temperature curve are stored. With computer communication function, communication software is attached, two curves can be displayed in the same time, and buzz will be given after soldering is finished or removed;

* Buzz after soldering is finished or desolding;

* Hand vacuum pen is adjustable for removing BGA;

* Over-heating alarm and protection for the upper hot air heating header.

Details: