Description:

* Hot air header and mounting header are designed 2 in 1, and have both the auto soldering and mounting function;

* Color optical system with functions of split vision, zoom - in and micro-adjust, equipped with aberration detection device; with auto focus and software operation function,22 times optical focus; able to rework BGA sized up to 70mm x 70mm;

* Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time;

* Build-in vacuum pump; 360 degree rotation in Φ angle; mounting nozzle is micro-adjustable;

* 6 segments of temperature up (down) and 6 segments constant temperature control, 20 groups of temperature curve are stored; Curve analysis can be carried out on the touch screen and has the communication function as computers ,with software attached

* Able to arrive at three independent temperature zone(the third is option),temperature and time can be displayed digitally on the touch screen; rework able CCBGA ;

* The supports rack can be adjusted to restrain the local sink age of the BGA soldering area;

* Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;

* Heaters can be moved in any location within the working area to fit for reworking BGA in different positions on PCB;

* Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independent controlled;

* Equipped with different Ti alloy hot air nozzles, easy to replace and able to locate in any angle.

* Driven by the stepping motor, the integrative hot air header can store 20 groups of different BGA heating points and register marks.

Details: