Description:

* Hot air header and mounting header are designed 2 in 1, and, can store 20 groups of working locations, with the precision to 0.02mm;

* Driven by X and Y axes step motor, operated with rocker bar , micro-movable when approaching the destination; able to store 20 groups of data;

* Color optical system with functions of split vision, zoom-in and micro-adjust, equipped with abbreviation detection device, auto focus, operate the software,; 30X optical focus; able to rework BGA sized up to 70mm x 70mm;

* Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time;

* Color LCD monitor;

* Suction nozzle can identify automatically material and mounting height, can constrain the pressure within a small range;

* Connected with nitrogen outside for nitrogen-protected soldering and desoldering;

* With build-in vacuum pump; 360 degree rotation in Φ angle; mounting nozzle is micro-adjustable;

* The supports rock can be adjustable to restrain the local sinkage of the BGA soldering area;

* 8 segments of temperature up (down) and 8 segments constant temperature control, 20 groups of temperature curve are stored; curve analysis can be carried out on the touch screen; with computer communication function, communication software is attached;

* Three independent heating areas, temperature and time can be displayed digitally on the touch screen; reworkable CGA;

* Heaters can be movable in any location within the working area to fit for reworking BGA in different positions on PCB;

* Protect from lack of air pressure;

* Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independent controlled;

* Equipped with different Ti alloy hot air nozzles, easy to replace; can able to locate in any angle.

Details: